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  BGA Rework Station  
  BGA Chip

Many manufacturers of superior SMT assemblies depend on real-time x-ray technology to evaluate solder joint efficacy for BGAs and various leadless deals which cannot be examined by typical imaginative and prescient systems.

For assemblers who basis BGA solder voids to ascertain high quality, Glenbrook's patented x-ray the camera package a special advantage: it is the only computer not topic to Voltage Blooming. Void measurements remain in line with at all voltages, delivering dependable go/malfunction data.

As an environmentally friendly to large deals with elevated pin counts, golf ball grid rows (BGAs) have diverse advantages: smaller size, reduce inductance, diminished coplanarity and lack of skewing. But as soon as a BGA is placed, how can the efficacy of its solder bond be measured?

Many manufacturers of superior SMT assemblies depend on Glenbrook's real-time x-ray technology to evaluate solder joint efficacy for BGAs and various leadless deals which cannot be examined by typical imaginative and prescient systems. In the course of working with our systems, these manufacturers have verified a basic precept of productive assembly: it's a lot more effective to examine the process, instead of the product.

Real-time x-ray inspection helps to specify high quality as an integral aspect of the process, correct from the start, and to maintain it all through the line, for BGA evaluation or any various aspect of the process. In the development stage, real-time x-ray inspection denotes the optimal parameters expected to maintain a process in control. In the course of production audits, it guarantees which individuals parameters are being maintained.

 

S-909 Specifications:

BGA Rework Station S909

Total Power: 5200 W
Top Heater: 800 W
Lower Heater: 1200 W
Bottom infrared pre-heater: 3000 W
Power Supply: AC 200V 50/60 HZ
Machine Dimension: 710*680*660 mm
PCB Min Size: 40*40 mm
PCB Max Size: 450*400 mm

 

 
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